INS3-1407
Thermally Drawn, Meter-Scale Fiber Supercapacitors for Wearable Textiles and Implantable Bioelectronics
Topic
S3. Processing / Fabrications (Emerging Horizons in Polymer Processing and Fabrication)
When and Where
Sep 29, 2026
17:05 - 17:30
Room 104
Session Chairs
Juhyuk PARK
Presenter(s)
Jung Tae Lee (Kyung Hee University)
Co-Author(s)
Abstract
While fiber-shaped supercapacitors hold immense promise for next-generation electronics, transitioning from short laboratory samples to continuous, highly functional form factors has remained a critical bottleneck. Here, we overcome the traditional limits of scalability, flexibility, and protection through a top-down thermal drawing process that transforms a macroscale preform into a fully integrated, mechanically robust fiber supercapacitor. This engineered preform systematically unifies five functional layers—including electrode and gel electrolyte layers, current collectors, and a protective outer cladding—into a single, continuous architecture. By utilizing application-tailored gel electrodes and electrolytes within this versatile platform, we establish energy storage solutions for both smart textiles and implantable systems. For wearable electronics, the continuous fiber exhibits exceptional mechanical durability, withstanding severe bending and repeated washing cycles while maintaining high energy storage performance. For biomedical applications, the fiber platform is optimized to offer self-healing properties and remarkable biocompatibility under dynamic physiological motions, which is confirmed by long-term in vivo evaluations showing minimal immune response, successful device operation in freely moving subjects, and precise, targeted optogenetic stimulation of both central and peripheral nervous systems. Ultimately, this work proposes the potential for significant advancements in the development of next-generation fiber energy storage devices, promising substantial enhancements in functionality and seamless integration for the future of wearable technologies and implantable bioelectronics.
