KES3-1382
3D Printable Composite Materials for Form-Factor Free Electronics and Energy Applications
Topic
S3. Processing / Fabrications (Emerging Horizons in Polymer Processing and Fabrication)
When and Where
Sep 29, 2026
15:50 - 16:15
Room 104
Session Chairs
Sungmin PARK
Presenter(s)
Sunho Jeong (Kyung Hee University)
Co-Author(s)
Abstract
Recently, the fabrication of 3D circuits has attracted significant attention in the context of the realization of a new-generation of printed electronics. It is demonstrated that highly conductive 3D features can be created simply by successive 3D printing and laser writing processes, facilitating a user-friendly design of low-cost, high performance, form-factor free electrical circuits. Miniaturized electrochemical energy storage units also have gained tremendous attention in the fields of microelectronic electronics systems, with the advent of the era of “internet of things”. Shape configurable energy storage devices can be implemented on arbitrarily designable electronics system through 3D printing on the designated surfaces of device systems. In this talk, I introduce a methodology of fabricating an all-3D-printed solid-state energy storage. The stretchable electronics is a critical prerequisite to achieve form-factor free applications. The liquid metal particles have been considered as a viable candidate filler that can meet the necessary properties. However, a mechanical activation process is needed to generate interconnected liquid channels inside elastomeric polymers. I suggest a chemical strategy of synthesizing liquid metal composites to eliminate the necessity of additional mechanical activation processes.
