POS4-1262
Fabrication of Liquid Crystal Elastomer/h-BN Composites with Enhanced Thermal Conduction via Alignment Control
Topic
S4. Colloids, Interfaces, and Molecular Assemblies for Functional Soft Materials
When and Where
Sep 29, 2026
08:30 - 09:30
Room 301 (Grand Ballroom)
Session Chairs
Hae Jung SON
Boseok KANG
Presenter(s)
Bukyung Kim (Pusan National University)
Co-Author(s)
Abstract
As electronic devices become increasingly integrated and power-dense, the demand for high-performance heat-dissipating polymer composites for printed circuit board (PCB) substrates continues to grow. Because polymer matrices are intrinsically poor thermal conductors, thermally conductive fillers such as hexagonal boron nitride (h-BN) are widely incorporated. However, high filler loading often compromises mechanical properties and processability, and simply increasing filler content is insufficient to establish continuous, efficient heat-transfer pathways; rather, precise control over the alignment of both the filler and the polymer matrix is essential for constructing directional thermal conduction pathways. In this study, a heat-dissipating composite was fabricated by simultaneously controlling the alignment of a liquid crystal elastomer (LCE) matrix and h-BN filler. X-ray scattering and SEM analyses confirmed vertical alignment of the mesogens and horizontal alignment of the h-BN platelets, respectively. The aligned composite exhibited enhanced overall thermal conductivity compared to the non-aligned polydomain composite, and the directional dependence of thermal conduction arising from the distinct alignment of the matrix and filler will be further discussed.
