KES3-1229
Advanced Epoxy-Based Non-Conductive Films Utilizing Hybrid Filler Networks for Thermal Management in 3D HBM Integration
Topic
S3. Processing / Fabrications (Emerging Horizons in Polymer Processing and Fabrication)
When and Where
Sep 30, 2026
11:10 - 11:35
Room 104
Session Chairs
Sungmin PARK
Presenter(s)
Sang Eun Shim (Inha University)
Co-Author(s)
Abstract
The exponential growth of artificial intelligence (AI) and high-performance computing has driven an unprecedented demand for High Bandwidth Memory (HBM) architectures. Consequently, resolving the severe thermal dissipation and structural reliability issues associated with dense 3D vertical stacking has become a paramount industry challenge. In this study, we introduce a newly formulated, high-performance Non-Conductive Film (NCF) tailored specifically for advanced 3D HBM thermo-compression bonding processes.
To effectively overcome the thermal bottlenecks of vertical integration, we developed and optimized a novel hybrid filler system. By strategically blending spherical micro-particles with high-aspect-ratio fillers, we constructed a highly efficient thermal percolation network, which enabled the composite to achieve a remarkable thermal conductivity. Furthermore, a specialized high-functional epoxy matrix was engineered to exhibit low viscosity for flawless, void-free gap filling, alongside a low coefficient of thermal expansion (CTE) to minimize warpage during compression and bonding.
Rigorous evaluations of the resulting NCF composites' rheological properties, thermal stability, and long-term reliability were conducted. The results confirm that the synergistic integration of the advanced hybrid fillers and the tailored epoxy matrix significantly improves heat dissipation while preserving excellent electrical insulation and robust adhesion. Ultimately, these findings highlight the proposed NCF as a highly robust and reliable material solution for addressing the complex thermo-mechanical demands of next-generation semiconductor packaging technologies.
To effectively overcome the thermal bottlenecks of vertical integration, we developed and optimized a novel hybrid filler system. By strategically blending spherical micro-particles with high-aspect-ratio fillers, we constructed a highly efficient thermal percolation network, which enabled the composite to achieve a remarkable thermal conductivity. Furthermore, a specialized high-functional epoxy matrix was engineered to exhibit low viscosity for flawless, void-free gap filling, alongside a low coefficient of thermal expansion (CTE) to minimize warpage during compression and bonding.
Rigorous evaluations of the resulting NCF composites' rheological properties, thermal stability, and long-term reliability were conducted. The results confirm that the synergistic integration of the advanced hybrid fillers and the tailored epoxy matrix significantly improves heat dissipation while preserving excellent electrical insulation and robust adhesion. Ultimately, these findings highlight the proposed NCF as a highly robust and reliable material solution for addressing the complex thermo-mechanical demands of next-generation semiconductor packaging technologies.
