INS11-1029
Measurement and Materials Platforms for Enabling Next Generation Semiconductor Packaging Technologies
Topic
S11. PMSE–PSK50 Anniversary Symposium: Advancing Polymer Science for a Sustainable and Intelligent Future
When and Where
Sep 29, 2026
15:00 - 15:25
Room 110
Session Chairs
Dhriti NEPAL
Presenter(s)
Christopher Soles (National Institute of Standards and Technology)
Co-Author(s)
Abstract
The heterogenous integration of next generation semiconductor components into complicated 2D and 3D architectures increases the demands on the packaging materials that are used to hold these components together in a functional semiconductor device. These packaging materials are typically rigid polymeric resins that start out as a liquid or semi-soft solid precursor that can readily flow and encapsulate the integrated device. During assembly the materials undergo a curing reaction where the precursors cross-link to form a rigid packaging resin. Controlling the process by which these resins transform from a liquid to a solid, including the chemical kinetics and rheological transitions, has a significant impact on the final properties of the packaging material and the ultimate performance and durability of the device. Differences in the way the packaging material is processed can affect key properties such as the degree of cure, time dependent rheology, cure shrinkage stresses, coefficients of thermal expansion, and thermal mismatch stresses – all key properties that affect performance and reliability of the semiconductor device. In this presentation I will describe our efforts to develop a suite of metrology tools to quantify the critical properties, under device relevant conditions, of the polymeric packaging resins that are being developed for next-generation microelectronics packaging. These measurements will be deployed on model, open-source resins that serve as a platform for benchmarking and developed commercial formulations. The development and refinement of these measurement platforms will equip industry and academia with both the measurement tools and data needed to develop the next generation of high-performance packaging materials.
