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Program Scientific Program
POS5-1008

Anisotropic thermal interface material with magnetically programmable heat pathways based on polydopamine-mediated Fe3O4/carbon nanotube polymer nanocomposites

When and Where

Nov 30, -0001   00:00 - 00:00

Presenter(s)

dongyeong gim (Gwangju Institute of Science and Technology)

Co-Author(s)

minjeong Ha (Gwangju Institute of Science and Technology), hyeokju Kwon (Gwangju Institute of Science and Technology)

Abstract

As electronic devices become smaller and more powerful, heat accumulation has emerged as a critical limitation for their performance and reliability. Therefore, effective thermal management requires thermal interface materials (TIMs) that conduct heat directionally while remaining electrically insulating to prevent short circuits. Most solutions depend on insulating ceramic fillers, which require high loadings and harsh silane or plasma treatment, raising cost and processing complexity. Here, we report a polymer composite in which multi-walled carbon nanotubes (MWCNTs) serve as the thermally conductive material while keeping the composite electrically insulating. A polydopamine (PDA) layer, formed in facile process without any prior acid or plasma treatment, simultaneously anchors Fe₃O₄ nanoparticles onto the MWCNT walls and preserves the sp² lattice of the nanotubes. The Fe₃O₄ coating makes the MWCNTs responsive to magnetic fields, so that they are aligned along applied magnetic field and form a continuous heat-conduction network within the polymer matrix. The resulting composite exhibits pronounced anisotropic thermal conductivity along the alignment direction. Unlike conventional composites with MWCNTs, the insulating PDA/Fe3O4 interphase suppresses electron transport. Because the orientation is dictated by the field direction during processing, the heat-conduction pathways are configured on demand before the matrix is cured. The composite combines directional heat flow, electrical insulation from a conductive filler, low filler loading, and a simple treatment-free synthesis. These features make it a complementary alternative to ceramic-filler TIMs for chip packaging and power electronics.
Supported by
Korea Tourism Organization BUSAN TOURISM ORGANIZATION
Sponsored by
Korea Research Institute of Chemical Technology Advanced Materials Division Sejin CI DONGJIN SEMICHEM HAEDONG SCIENCE FOUNDATION COSMAX EcoProBM Young Eng. Sci. Doosan SAMSUNG SDI S-OIL 한국도레이과학진흥재단