Thermal Enhancement by Modified Hardeners in Epoxy Composites Containing Hexagonal Boron Nitride for Thermal Insulation
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The necessity for highly processable thermally conductive polymeric composites for advanced heat dissipation is increasing. These polymeric composites must be easy to handle, inexpensive, and possess excellent mechanical properties. However, the relatively low thermal conductivity, which ranges of 0.10-0.25 W m-1 K-1, has been observed to present challenge. Here, a novel epoxy resin was designed, incorporating biphenyl group to enhance thermal properties by increasing intermolecular interaction as a hardener in thermally conductive polymeric composites. The results achieved high thermal conductivity as a hardener of thermally conductive polymeric composites, suggesting its potential for wide application as next-generation heat dissipation material.