Advanced Epoxy Composites: Thermal and Moldability Enhancements through Alkyl Chain-Modified LCP Mesogens.
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Epoxy resins are known for their mechanical strength and chemical resistance, but their limited moldability and thermal conductivity restrict their use in applications requiring efficient thermal management. This study addresses these limitations by incorporating liquid crystal polymer (LCP) mesogens with varying alkyl chain lengths into epoxy matrices. A series of LCP mesogens were synthesized and integrated into a commercial epoxy resin. The plate-like aromatic rings of the mesogens facilitate efficient stacking, while the alkyl chains lower the melting and curing points compared to conventional LCPs. Advanced thermal analysis revealed significant improvements in the thermal conductivity and moldability of the composites, making the modified epoxy suitable for complex molding processes and applications that demand effective heat dissipation. The findings indicate that LCP mesogens enhance the processing and performance of epoxy resins, offering new opportunities in electronics and other fields where thermal management is critical.