Development of High Thermal Conductivity Epoxy Resin with Star-Shaped Crystalline Amine Curing Agents
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초록
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The rapid advancement in semiconductor technology has created a growing demand for effective thermal management to enhance device performance and longevity. Epoxy resin, widely used for thermal dissipation due to its excellent adhesion and mechanical strength, has a drawback of low thermal conductivity (~0.2 W/mK). In this study, we developed a novel epoxy resin using a starshaped crystalline amine curing agent to improve thermal conductivity. The unique structure of the curing agent, with four aromatic rings connected by ester groups, facilitates rapid phonon transport through the bulk and rigid structure. Consequently, the epoxy resin cured with this agent exhibits approximately 20% higher thermal conductivity in pristine resin and over 50% higher thermal conductivity in 50wt% of BN composites compared to conventional epoxy. This new epoxy resin is highly suitable as a thermal interface material and encapsulant for next-generation semiconductors, offering improved heat management