Preparation of Polyimide Composite Film with High Thermal Conductivity, Electromagnetic Interference Shielding and Self-Healing Properties For Semiconductor Packages
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초록
내용
Recent semiconductor package technologies require not only mechanical protection but also electromagnetic interference (EMI) shielding due to the increasing density of semiconductor components. To enhance EMI shielding efficiency, extensive research is being conducted on creating composite materials with porous or encapsulated phase change structures to increase multiple reflection losses. However, these structures have the disadvantage of being susceptible to moisture due to internal spaces and exhibiting lower thermal conductivity. To address these issues, we prepared a polyimide composite film and investigated its characteristics with low moisture permeability, high EMI shielding efficiency, self-healing properties, and excellent thermal conductivity.