Preparation of Self-Healing Capsules of Liquid Metal/Polyimide
발표자
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초록
내용
Gallium-based liquid metal (LM) at room temperature has non-toxicity, flowability, and high electrical and thermal conductivity characteristics. LM can be applied to electrode materials of various electronic devices in virtue of these characteristics. In this study, the purpose is to prepare a liquid metal capsule using a polyimide (PI) as a shell material. After surface modification of the liquid gallium alloy particles, LM was encapsulated through chemical bonding between surface amino group and the end group of PI. The capsules with PI shell can be maintained even in a high-temperature soldering process. When damages occur in an electrical circuit containing the capsules, LM flows out from the ruptured capsules and fills the damaged site, leading to effective recovery of electrical pathways. The LM capsules were characterized by optical microscope, scanning electron microscope (SEM), Fourier-transform infrared spectroscope (FT-IR), and thermogravimetric analysis (TGA).