Low Dielectric, Copper-adhesive Poly(aryl ether ketone) Films for High-frequency Applications
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초록
내용
In this study, poly(aryl ether ketone) (PAEK) based low dielectric metal-adhesive substrates for next-generation high-frequency communication devices were developed. The PAEK copolymer substrate, synthesized from an optimum ratio of two monomers containing tert-butyl and phenyl groups, exhibited a low dielectric constant of 2.49 and a loss of 5.84×10-3. Furthermore, the film demonstrated high mechanical and thermal stability, achieving elastic modulus of 1.523 GPa and initial decomposition temperature of 477.0 ℃. By taking advantage of the self-initiating property of the benzophenone moiety within the PAEK structure, Cu-adhesive monomers glycidyl methacrylate (GMA) and 3-(trimethoxysilyl)propyl methacrylate (MPS) were successfully grafted onto the polymer surface. The final Cu-polymer laminate displayed an outstanding peel strength of 11.45 N/m, more than double that of a commercially bonded sheet-laminated polyimide film.