A Study on the Mechanical Characteristics of DLP Process Photocurable Resin with Temperature Variation
발표자
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초록
내용
Digital Light Processing (DLP), one of the promising polymer 3D printing technologies, uses specific wavelengths of light to cure the material in an area-by-area manner, which has the advantage of fast output. However, DLP also has the disadvantage of usage temperature sensitive materials, which can affect the results of the printing quality. Therefore, this study aimed to investigate whether the temperature of the photocurable resin has an effect on the mechanical properties during DLP, and to analyze the mechanical properties of the output by temperature to proceed more effectively. The photopolymerizable resin used in the study was Urethane Acrylate material consisting of Epoxy Acrylate Oligomer (20~30%), Acrylate Monomer (67~77%), and Photoinitiator (1~3%), and specimens were prepared by varying the heat treatment temperature (25, 50, 70, 90, 115 ℃) with the same resin. The mechanical properties were then compared by measuring the tensile strength (quasar 50) and hardness (MMT-X).