Synthesis and Copper Adhesion Properties of Semifluorinated Polynorbornenes
발표자
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초록
내용
To maximize electronic component scaling, high interconnect density structures are desired. With decreasing spacing between conductive elements, however, RC delay is emerging as a major barrier against further scaling. Low dielectric constant (low-k) materials are essential to address this. Fluoropolymers are promising due to their low dielectric constants along with their chemical and thermal stability. Due to the low surface energy of fluoropolymers, however, poor adhesion properties, especially to copper, must be addressed. We herein report the synthesis of semifluorinated polynorbornenes with varying fluorine contents. Their properties, including dielectric constants and copper peel strengths, are evaluated with the aim of providing structure-property relations which could provide principles to consider when designing polymeric low dielectric materials.