High-speed pulsed laser ablation is a promising technology in biomedical implants. Although the conventional laser can yield a high spatial resolution, Materials with a thickness above the micrometer scale cannot be ablated accurately due to lift up during ablation. This problem arises from the high energy release rate, which leads to a lack of flexibility. Here, we report a sustainable fabrication method, assembling the intrinsic adhesive property of a polymer onto the laser ablation process. This technology can improve the resolution up to 10 times higher of materials with micro-scale thicknesses. The entire procedure including patterning and integration accomplished perfect alignment in multi-layered patterning by in- and out-focusing, while achieving complete encapsulation through dynamic-covalent bonds between polymer layers. This advance could offer improved adjustments in the size and functional lifetime of the device, leading to an expansion of application capabilities.