Enhanced Heat Resistance of Fluorosilicone by Introduction of Phenyl Group
발표자
()
초록
내용
Fluorosilicone has various properties, such as chemical resistance to chemicals, low-temperature resistance and superhydrophbic. Even though it possesses these excellent properties, its inferior thermal stability limits various application in industries. The phenyl group efficiently improves thermal stbility by inhibiting backbiting degradation. We have investigated copolymerization of fluoro-phenyl silicone by anionic ring opening polymerization(AROP) of octamethylcyclotetrasiloxane (D4), tetramethyltetravinylcyclotetrasiloxane(Vi-D4), 1,3,5-tris(trifluoropropyl–methyl)cyclotrisiloxane(F-D3), and octaphenylcyclotetrasiloxane (P4) using tetramethylammonium silanolate (TMAS) as a initiator.
Acknowledgement: This work was supported by the Technology Innovation Program(Synthesis of modified fluorosilicone-based liquid and solid type fluorosilicone elastomers and development of semiconductor application materials, 20011100, the Ministry of Trade, Industry & Energy(MOTIE, Korea))