3D Printing of Polyimide Parts using Water-Processable Photosensitive Precursor Resins.
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Aromatic polyimides (PIs) have been used widely in varied industries due to their desirable mechanical strength and thermal and chemical resistance. However, the excellent properties of PIs generally impede conventional processing. Recently, photocuring three-dimensional printing (3D printing) technologies have emerged as a significant breakthrough in addressing this problem. The techonolgies can make PI parts into geometrically complex shapes easily and affordably. But, the relevant studies typically require toxic organic solvents, which cause safety concerns and environmental problems. Here, we prepare PI precursor resins using water as a solvent and obtain 3D parts of PI after digital light processing (DLP) 3D printing and post-thermal treatment. The 38 wt.% poly(amic acid) salt is used as the precursor, which has printable viscosity and achieves a low shrinkage rate between as-printed and final parts compared to other previous reports. Thus, this study is expected to be applied in various industrial fields in demand for PIs.