Fabrication and Characterization of Low Dielectric Polyimide/Silica Aerogel Nanocomposite Films for Flexible Printed Circuit Board Applications
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To achieve flexible printed circuit board (PCB) materials with significantly reduced dielectric constants, polyimide/silica aerogel (PI/SA) nanocomposite films were fabricated by incorporating varying contents of SA into PI derived from 4,4’-oxydiphthalic anhydride and 4,4’-oxydianiline. The composites' microstructure and morphology were characterized using SEM, EDS, and FT-IR. Their thermal transitions, thermal stability, and mechanical properties were examined via DSC, TGA, and tensile testing, respectively. Frequency-dependent dielectric properties were assessed with an LCR meter. The dielectric constant decreased from 3.02 in pristine PI film to 2.16 in a composite film containing 10 wt% SA. This ultralow dielectric constant is attributed to the uniform dispersion of SA with ~34.9 nm pores within the PI matrix. The experimental dielectric constants of the PI/SA nanocomposite films corresponded well with predictions from Maxwell-Garnett theory.