<em>A Multi-Component Visible-Light Initiating System for Rapid and Deep Photocuring through UV-opaque Polyimide Films</em>
발표자
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초록
내용
Polyimides (PIs) are high-performance polymers known for thermal stability and mechanical resilience, ideal for harsh environments. These properties make PIs essential in electronic devices, especially flexible printed circuit boards (FPCBs). However, bent FPCBs can suffer physical impact, deforming the board and damaging Cu wiring. Using a resin with excellent mechanical properties can protect Cu wiring. Conventional UV-curable resins are unsuitable due to PI film's UV opacity, and thermal curing is slower and risky. We propose a multicomponent photoinitiating system for rapid, deep photocuring of acrylic resins through UV-opaque PI films under visible light. Combining camphorquinone/amine with 4DP-IPN/borate/iodonium, the system achieved superior speed and depth. It achieved a curing depth of over 1 cm in 10 seconds under 480 nm LED (1000 mW/cm²), confirming its utility for high-curvature FPCB applications.