Validation of compatibility with non-etching type oxide chemicals depending on PCB raw materials
발표자
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초록
내용
Newly designed materials are developing in field of printed circuit board (PCB) industry. For instance, various raw material suppliers are trying to compete by developing new pre-impregnated (PREPREG) material for advanced performance. To apply superior materials to PCB, not only satisfying the Signal Integrity (SI) is necessary, but also reliability of the material. Oxide Treatment (OT) prior to laminate is also important to ensure reliability of PCB, because the OT increases the adhesion between copper foil and resin by making the surface rougher. However, the reaction between PREPREG and non-etching type oxide is different depending on the materials, which causes delamination after PCB manufacturing. In this study, 4 materials were selected, and the adhesion parameters were set through interfacial energy analysis of the resin system and oxide chemicals. We plan to verify the reliability of the adhesion parameters by manufacturing PCB of the same design using 4 materials.