Fabrication of Thermal Interface Materials with Enhanced Anisotropic Thermal Conductivity through Dielectrophoretic Alignment of Biphasic Metal Fillers
발표자
()
초록
내용
The growing demand for Thermal Interface Material (TIM) composites with high thermal conductivity and elasticity stems from the need for effective thermal management in flexible electronics. In this study, we applied the dielectrophoresis (DEP) process to obtain anisometric alignment of metallic filler particles in a polymer matrix, enhancing the anisotropic thermal conductivity of pad-type TIMs. With the dielectrophoretic chaining (DEP-C) of biphasic metal particles, using a eutectic gallium–indium alloy and copper as fillers, the TIMs achieved anisotropic thermal conductivity up to 0.6 W/m*K at a 20% filler volume ratio. The TIMs exhibited not only enhanced thermal performance but also maintained elasticity and flexibility, discerned through mechanical property testing. Finally, the heat dissipation performance of the TIMs validated by the simple test with a light-emitting diode, demonstrating improved heat dissipation with DEP-C process.