The Effect of Thermal Insulating Property of polysilsesquioxane on the Size of Intramolecular Void Spaces
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초록
내용
For the developement of thermal insulating materials, polysilsesquioxane is suitable for increasing thermal insulation. To improve thermal insulation, it is necessary to enhance the size of intramolecular void spaces in polysilsesquioxane matrix. In this study, oligomethylsilsesquioxane (MSQ-OH) is synthesized through the sol-gel reaction of triethoxymethylsilane. To increase the thermal insulation of polysilsesquioxane film, MSQ-OH was cross-linked by the reaction of epoxy ring of MSQ-OH with hydroxyl group of 1,4-butanediol diglycidyl ether (BDGE). For comparison of thermal insulating property based on the size of intramolecular void spaces, MSQ-OH was cross-linked with glycerol diglycidyl ether having a shorter chain length than BDGE. The thermal insulation property of polysilsesquioxane film was improved by increasing the size of intramolecular void spaces. The properties of polysilsesquioxane films were characterized by using various analytical tools.