Controlling Twist Rigidity and Molecular Orientation of Polyimides for Realizing Low Dielectric Constant and Dissipation Factor at High Frequency
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With the advancement of 5G communication, low dielectric polymeric materials are essential for stable and fast signal transmission at high frequencies. Aromatic polyimides (PIs), valued for their heat resistance, mechanical strength, and electrical insulation, are widely used in the microelectronics and high-frequency communication industries. However, the polar imide rings in PI result in high dielectric properties. Here, we propose a PI with low dielectric properties by controlling the twist rigidity and chain packing of the PI mainchain. Methyl substituents of amino groups enhance torsional rigidity, limit chain mobility, and introduce free volume, resulting in a low dielectric constant and dissipation factor. Ester linkages in PI backbones further increase chain rigidity and orientation, reducing intermolecular friction and the dissipation factor. These results suggest a structural design strategy to improve PI's performance as a dielectric material for high-frequency applications.