Analysis and Characterization of Enhanced Thermal Properties by Introducing Amide Groups into the Main Chain
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초록
내용
With the advancement of cutting-edge technology, high-heat-resistant polymers are being spotlighted as essential materials for high reliability and high performance. To enhance the heat resistance of polyimide, an amide functional group capable of forming hydrogen bond interactions was introduced into the molecular structure. The aim of this study is to provide excellent heat resistance, flexibility, and low thermal expansion coefficient by offering a highly oriented and chain-packing structure through the amide functional group. After synthesizing diamines with four types of amide functional groups, they were reacted with four types of anhydrides to synthesize poly(amic acid) (PAA), and polyimide films were obtained through thermal imidization. The spectroscopic properties were then analyzed using FT-NMR and FT-IR. Additionally, the thermal properties of the polyimide films were analyzed using TGA, DSC, and TMA, and their mechanical properties were analyzed using UTM.