Crystalline Thermosetting Polyimides Based on Mesogen-co-Polymerized Phenylethynyl End-Capped Imide Oligomer
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Polyimides (PIs) are widely utilized due to their excellent mechanical properties and thermal stability, particularly in aircraft and aerospace applications where they serve as the matrix for high-performance composites. Introducing phenylethynyl groups at the ends of PI chains allows for molecular weight adjustment and high-temperature curing, enhancing the resin's thermal and mechanical properties. Incorporating mesogenic and spacer groups into the polymer chain enables liquid crystal behavior within a specific temperature range. Forming a cross-linked network within this range increases polymer chain interactions, improving mechanical and thermal properties. In this study, liquid crystal thermosetting imide oligomers were designed by copolymerizing non-symmetrical biphenyl dianhydride with two different diamines containing mesogenic moieties. We investigated whether the liquid crystal range overlaps with the crosslinking temperature and analyzed the resulting material properties.