Synthesis and Characterization of Transparent and Flexible Polyimide Films Using Aromatic Diamine monomers Contaning Amide Group.
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Polyimide films are used for flexible circuit boards due to their excellent heat resistance, chemical resistance, and electrical properties. In this study, two types of amide-containing diamine were synthesized, and polyimide films were produced by reacting them with dianhydrides, 4,4'-(Hexafluoroisopropylidene)diphthalic anhydride (6FDA), Diphenylsulfone tetracarboxylic dianhydride (DSDA), and 4,4'-(4,4'-Isopropylidenediphenoxy)diphthalic anhydride (BPADA). For chemical structure of the diamine monomer analysis, Fourier Transform Nuclear Magnetic Resonance (FT-NMR), Fourier Transform Infrared Spectroscopy (FT-IR) were used. The thermal and mechanical properties of the film were estimated using a thermo-gravimetric analyzer (TGA), differential scanning calorimetry (DSC), and a universal tensile machine (UTM). It was confirmed that most of the thermal decomposition occurred above 400℃, and the tensile strength was 70MPa.