Thermotropic Liquid Crystalline Polyester/Hollow Glass Microsphere Composites for Low Dielectric PCB Material Applications
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초록
내용
The development of communication devices has increased the demand for high-performance printed circuit board (PCB) materials in high-speed communication systems. PCB materials operating in high-frequency bands require a low dielectric constant and low dielectric loss to minimize signal attenuation. Thermotropic liquid crystalline polyester (TLCP) is a thermoplastic widely studied for high-speed communication antennas and PCB substrates due to its low dielectric constant, low moisture absorption and high thermal stability. Hollow glass microsphere (HGM), known for their high porosity (≥80%), excellent thermal stability, and chemical resistance, can reduce weight and dielectric constant while enhancing thermal stability. In this study, TLCP/HGM composites were prepared using a masterbatch melt-compounding technique. These composites exhibited approximately 30% lower dielectric constant than pure TLCP, along with high thermal properties, hydrophobicity, and good processability.