Surface Modified Silica Nanoparticles with Chelating Agents for CMP Applications
발표자
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초록
내용
The CMP process is essential for semiconductors. And metal ions generated in the CMP slurry composition adsorb onto the wafer, causing various problems. To solve the problem, in this study a self-refining method is developed by introducing a silane linker of silica nanoparticle (SiNPs) and 2 types of chelating agents. The quantitative analysis of the synthesized particles is confirmed by TGA, the optimal washing conditions are confirmed by FT-IR, and the suppression of metal ions is confirmed by ICP-AES. Synthetic substances are used as abrasives or metal-suppressing additives in the CMP process.