Graphene oxide/Fe3O4/Epoxy composite for high thermal conductivity and interfacial property
발표자
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초록
내용
With increasing of power density, overheating in electronic devices is an important problem. Generally, between heated device and thermal sink, there is a layer of thermal interface materials (TIMs) with high thermal conductivity. Epoxy resin has been widely used as the matrix of TIMs in electronic industry due to its good mechanical properties and chemical resistance, however it has low thermal property. We prepared the graphene oxide/Fe3O4(magnetic GO, MGO) as the main thermally conductivity filler referring that both Fe3O4 and Graphene oxide are fillers with high thermal conductivity MGO is also expected to increase interfacial property between epoxy and the nanoparticle. In this study, we fabricated MGO/Epoxy nanocomposite, and measured interfacial properties as well as the thermal property to investigate the efficiency of the MGO as a nanofiller of epoxy resin for TIMs application.