Degradable and Low-Dielectric Adhesive for High-Frequency Electronic Devices
발표자
()
초록
내용
The importance of material development for high-frequency is increasing with the growth of 5G communication systems. To express excellent signal transmission performance at high-frequency, developing a low-dielectric adhesive that has improved adhesion between the copper foil and dielectric material is essential. In addition, degradable properties ease waste disposal in communication equipment and reduce the environmental burden. Herein, we synthesized the low dielectric adhesive through the click reaction between an alkyne and azide compounds including silyl ether that can be degraded in acidic conditions. The peel strength was upper than 1.0N/mm and the dielectric constant measured at 10GHz was under 3.0. The weight loss of cured adhesive layer in the HCl solution was measured. This degradable adhesive can be used to develop eco-friendly electronic devices used for 5G communication.