Improved Interfacial Adhesion between Polymer Substrates and Copper Nanoparticle films through Silane Coupling Agents
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Adhesion between polymer substrates and copper seed layers is a challenge in advanced communication device applications. In this work, a silane coupling agent containing azide group is introduced to improve interfacial adhesion between polyimide (PI) substrates and polyvinylpyrrolidone-coated copper nanoparticle films. The deposition of the silane coupling agents on the hydroxyl group-functionalized surfaces of the polymer substrates induce the covalent bonds of the self-assembled layers (SALs) and the PI films. The azide groups of the SALs allow for cross-linking with the polyvinylpyrrolidone ligands of the copper nanoparticles through heat treatment. The strong covalent bonds contribute to the enhancement of adhesion, which was evaluated by tape test. In the tape test, the remaining area of the copper nanoparticle layers was rated at 100% on the surface-engineered substrates, while it was rated at 0% on the bare substrates.