Study of Materials and Manufacturing Process for Stretchable Electronics
발표자
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초록
내용
Conventional electronic devices consist of rigid substrates, electrodes, and unit devices. If they are flexible, they can be freely patterned, high-density wiring and applied to wearable electronics. This study reports on materials and manufacturing process for Multi-layer Stretchable Printed Circuit Board(sPCB). We made partially stretchable Rigid island substrate that only the part which mount the unit device is rigid. This allows for free patterning. In addition, this study has several advantages in terms of integration. First, 3D nozzle jet printing enables fine printing, which reduces wire spacing. Second, the electrode of this study has a stretching durability, so it can be used linear shaped structure, which takes up less space. Last, since it is manufactured as a multi-layer, it is possible to prevent crosstalk caused by the high integration that occurs when sPCB is manufactured as a single layer. So, this study is a great advantage as a sPCB.