Fabrication of Low-Profile Flexible Copper Clad Laminate for High-Frequency Communication
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초록
내용
With the development of 5G technology, there is a demand for weight reduction and miniaturization of various electronic devices such as smartphones, cameras, and laptops. 5G is a communication technology with high speed 20 times faster than 4G, ultra-low latency with 10 short communication delays, and ultra-connection with 10 more connected devices. In the high-frequency circuit board, the conductor loss from the copper foil and the dielectric loss from the dielectric insulating material are two main factors causing the signal transmission loss. To date, the conventional way to reduce the conductor loss is to use the low-profile copper foil. Here, we propose the highly adhesive and low-profile copper films for high-frequency flexible circuit board. We developed a flexible copper clad laminate (FCCL) with excellent adhesion between the copper layer and the dielectric insulating material. We used surface-oxide free copper nanoparticles as a seed layer for electroplating