Improvement of heating dissipation of liquid crystalline epoxy thermoset based on biphenyl mesogen
발표자
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초록
내용
Epoxy resins are a ubiquitous class of thermoset and widely used in adhesives, coatings, painting, and matrices as electronic parts in consideration of their superior properties. Conventional epoxy resins’ thermal conductivity (T/C) is quite low around 0.17-0.2 W/mK. This value could not meet the requirement for heat-dissipating material of modern electric devices. The solution for increasing T/C is liquid crystal epoxy (LCE) thermosets with high crystalline structures when cured monomers containing rigid-rod mesogen in LC phase to retain the crystalline structure. In this study, a series of LCE monomers based on biphenyl mesogen was synthesized and characterized by appropriate analytical methods. The LCE thermosets were fabricated by curing the monomers with suitable curing agents in the LC phase. It is notable that the monomers display LC behaviors with a wide range of temperatures and the cured products show high thermal conductivity as well as good mechanical properties.