Preparation of highly transparent and thermal conductive Polyurethane acrylate-based adhesives with boron nitride by UV curing for electronic device
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내용
In this work, polyurethane acrylate (PUA)-based adhesives were synthesized through UV curing for electronic device applications. The PUA oligomer was created utilizing Polypropylene glycol (PPG), Isophorone diisocyanate (IPDI), and 2-Hydroxyethyl methacrylate (HEMA). Then, to fabricate UV-cured PUA film, trimethylolpropane triacrylate (TMPTA) and 1-Hydroxycyclohexyl phenyl ketone are used as a cross-linker agent and a photo-initiator, respectively. Boron nitride nanoparticles (BN) were also incorporated to improve the thermal conductivity of the PUA film. The addition of BN resulted in significant enhancement of the thermal conductivity of the adhesives. The optimal content of BN was determined to be 7.5 wt% among the concentrations of 5, 7.5, and 10 wt%. The resulting adhesives showed high thermal conductivity and were suitable for use as thermal interface materials in electronic devices. In future work, we will investigate mechanical and tensile properties of the PUA-BN film.