Fabrication of Heat Dissipation Composite with Sandwich Structure for Electrical and Electronic Applications
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초록
내용
In recent years, electronic devices are becoming more dense and highly integrated with the purpose of lightweight, miniaturization, and multifunctionality. For this reason, a lot of heat is generated in the devices when using them and this heat brings the main cause of deterioration and malfunction of the electronic device. In this study, a heat radiating composite film with a sandwich structure was fabricated. Epoxy was used as the matrix, and carbon nanotube and boron nitride were used as the thermal conductive filler. The composite has high thermal conductivity and strong mechanical properties by filling an appropriate amount of carbon nanotubes while having electrical insulation by fabricating a sandwich structure in which an electrically insulating BN layer is inserted. The characterization of the composite was done by DSC, UTM, TGA, LFA etc.