Improving the thermal conductivity of PI film by adding graphene sheets exfoliated by the electrostatic discharge process
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초록
내용
The need for effective heat dissipators is growing as electronic devices are getting integrated. Recently, a carbonized polyimide film is considered a strong candidate for thermally conductive material. To enhance the conductivity of polyimide, adding conductive carbon material is considered intensively. To prepare excellent conductive filler material, graphene sheets are exfoliated from graphite rods by the electrostatic discharge method. The resulting graphene sheets exhibited superior structural and chemical properties. Consequently, the carbonized polyimide film fabricated with a mixture of polyamic acid and graphene sheets exhibited up to 26.8 times higher thermal conductivity and 72% reduced electrical resistance than those of pristine carbonized polyimide film. These results suggest that graphene from the electrostatic discharge method can be the perfect filler material for the conductive polyimide-based film.