Structural designs of thermoconductive nanocomposites with high EMI shielding
발표자
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초록
내용
The rapid development of modern electronics poses a threat to the functionality, stability, and lifespan of electronic components due to the accumulation of excessive heat and the electromagnetic interference (EMI) issues. More attention needs to be paid on the structural designs of polymer nanocomposites, specifically with the purpose of improving their thermal conductivity and EMI shielding effectiveness (SE) simultaneously. Here, several structural designs including sandwiched, segregated, vertically aligned, and 3D interconnected fillers have been successfully demonstrated to obtain multifunctional nanocomposites. The structural designs provide new possibilities for the scalable production of excellent thermoconductive nanocomposites with high EMI SE at low amount of filler and they could be applied for the next generation electronic devices.