Preparation of epoxy composite via LBL assembly with rGO and BPEI on epoxy microsphere for electrical and thermal conductivities
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초록
내용
Epoxy resin is one of the most common thermosetting polymers used in various applications because of its excellent mechanical property. In spite of this advantage, the relative low electrical and thermal conductivities are the main limits for the various applications. Reduced graphene oxide(rGO) is frequently applied as nanofiller to the epoxy resin due to the excellent conductivities, however it suffers from the difficulty of homogenous dispersion in the matrix. Herein, to solve these problems, the surface of epoxy microsphere was successfully surrounded with rGO and branched polyethylenimine(BPEI) via layer by layer assembly. Epoxy composite consisting of rGO/BPEI/epoxy microspheres, which facilitate the improvement of alignment and distribution of rGO in the epoxy matrix, was fabricated by emulsion polymerization and subsequent compression molding. Forming nanobrick wall structure epoxy microsphere coated with rGO and BPEI increased thermal and electrical conductivities simultaneously by constructing effective pathway.