Synthesis and Characterization of High Heat Resistant Polyimide with Amide Functional Group
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초록
내용
As the product is lightweight and miniaturized, high heat-resistant polymer materials are used in a wide range of industrial fields. In order to improve the heat resistance of polyimide, an amide functional group capable of forming hydrogen bond interactions in the molecular structure is introduced. The purpose of this study is to have excellent heat resistance, flexibility, and low thermal expansion coefficient by providing a high orientation and chain packing structure by the amide functional group. After synthesizing diamine with four kinds of amide functional groups, poly(amic acid) (PAA) was synthesized by reacting with four kinds of dianhydride and a polyimide film was obtained through thermal imidization. After that, spectroscopic characteristics were analyzed through FT-NMR and FT-IR. In addition, the thermal properties of polyimide films were analyzed through TGA, DSC, and TMA, and the mechanical properties were analyzed by UTM.