Synthesis and characterization for CTE value reduction and high heat-resistance copolyimide using various units
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Among polymers, polyimide has excellent glass transition temperature, dimensional stability, heat resistance, dielectric properties, and metal adhesion, and is widely used in electronic devices, semiconductor devices, and printed circuit board industries. High heat-resistant polymers are used in a wide range of industries, such as aviation, electronics, automobiles, and precision instruments, as essential materials for products as advanced technology develops. The heat resistance of polymers is closely related to their chemical structure, and they have a brittle property depending on the degree of rigidity of the structure, which has the effect of reducing mechanical properties. A benzoxazole unit was introduced into a new monomer to give higher heat resistance than existing polyimide and to increase mechanical strength compared to polybenzoxazole. It was designed by introducing an amide unit to maintain transparency as well as heat resistance and lower the high CTE value, which is a disadvantage of polyimide.