Synthesis and Characterization of Photosensitive Polyimide According to Cross-linker Content
발표자
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초록
내용
The photosensitive polymer can greatly shorten the pattern process of the semiconductor process and improve productivity. Among them, photosensitive polyimide can be applied as an electronic material because it has excellent thermal stability and direct pattern forming ability. Poly(amic acid) was synthesized by polymerizing 6FDA and ODA, and the newly synthesized AIPA-BMAEE was used as an end-capper. Then, three PAIs were synthesized by controlling the imidization of poly(amic acid), and their cross linker contents were different. After UV irradiation, crosslinking between polymer chains was formed, and the photoresist characteristics of negative type were confirmed. Thermal characteristics of the synthesized PAI were confirmed through TGA and DSC, and normalized thickness curve and FT-IR spectrum according to the degree of UV exposure were confirmed. As the cross-linker content increased, the photosensitivity was improved, which was observed through optical microscope and SEM.