Thermal conductivity and stability enhancement of Pickering emulsion composites by constructing segregated filler structure
발표자
()
초록
내용
Driven by growing demands for advanced electronics, materials for effective heat dissipation have been attracted much attention. Thermal paste, which is thermally conductive filler dispersed in liquid polymer matrix, ensures conformal contact between the heat sink and the heat source without voids. To further realize efficient heat dissipation, formation of continuous heat conduction pathway is a crucial aspect. For the paste with spherical fillers (i.e. alumina), therefore, high thermal conductivity can only be achieved at sufficiently high filler loadings. However, at such high filler loadings, the pastes start losing their advantages originated from the matrix, becoming heavy, brittle, stiff, and less processable. To these ends, Pickering emulsion composed of glycerol and silicone oil with alumina was prepared. The resulting emulsion with segregated alumina structure exhibits high thermal conductivity along with exceptional stability against both heat and moisture.