Improvement of Adhesion between Fluorinated Polymer and Copper Films using Ion Beam Treatment for FCCL
발표자
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초록
내용
In high frequency communication devices, flexible copper-clad laminates (FCCL) requires the low dielectric constant of fluorinated polymers to reduce a signal loss. But the inert surface of fluorinated polymer is a bottleneck to enhance the adhesion of Cu film via chemical bindings. Herein, we modified the top-most layer of fluorinated ethylene propylene (FEP) films via ion-beam treatments. And Cu seed layer (200 nm) and Cu film (20 μm) were deposited by magnetron sputtering and electrochemical deposition, respectively. In T-peel test, the maximum peel strength was 7.4 N/cm in ion-beam treated Cu/FEP film. FE-SEM and EDS analysis showed that the delamination was initiated inside the FEP films, not in the interlayer of Cu and FEP films. And hydrophilic surface was not effective to enhance the adhesion properties.