Polymer-Solvent Phase Separation in Quaternary Hybrid System for High Temperature Low-K Dielectrics
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With the rapid development of 5G communication networks, high-performance ultra-low dielectric constant polymeric materials are demanded for the application in high speed communication devices. The drawbacks of low porosity, inferior mechanical strength, and low thermal dimensional stability of the conventional microporous polyolefin-based films hinder their widely application in the high-frequency data transmission. Here we report a highly porous polyimide (PPI) insulators with excellent heat resistant as well as high moisture barrier properties via non-solvent induced phase separation (NIPS). The hierarchical micro/mesoporous morphology was precisely tunable by controlling the phase separation kinetics induced by the mesoporous molecular sieve in polymer matrix. A significant improvement of the broad-band dielectric properties of PI films was observed in response to filler hybridization and a consequent optimization of the thermodynamic phase separation process.