Interface Stabilization via Dry-Transfer Process Using Customized Mold for Long-Term-Stable Organic Photodiode
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초록
내용
Recently, dry-coating process has attracted significant attention for large-scale fabrication. Especially, transfer process can provide a precise printing of the target material without the damage of a bottom layer due to a relatively condition. In order to realize a residue-free transfer process, it is necessary to customize the transfer mold to match the target material. In this research, we designed and utilized high-surface-energy polyurethane acrylate (HS-PUA) to enable the transfer process through introducing wetting coefficient related with adhesions between each interface. Consequently, the customized-transfer process enabled stable operation through interface stabilization observed by the component analysis of X-ray photoelectron spectroscopy. The detectivity of the transferred device was maintained over 95% after 360 h, with no burn-in loss of internal resistance.