Preparation and thermal conductivity of poly(imide-siloxane) via a hybrid of micro- and nano-sized Al<SUB>2</SUB>O<SUB>3</SUB>
발표자
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초록
내용
In recent years, smart electronic devices such as smart watches, cellular phones, and tablet PCs have become smaller and lighter. In addition, as the performance of miniaturized devices is further improved, the problem of heat generation of smaller devices is also emerging. Therefore, heat-dissipating materials have recently been actively researched. We prepared poly(imide-siloxane) copolymers by combining polyimide with superior thermal properties and silicone polymer with flexibility. The cheap and commercially available Al2O3 (alumina) was used as a heat-dissipating filler. The alumina, controlled by the appropriate ratio of micro- and nano-sized, was added to the copolymer matrix. The polymer property and the thermal conductivity of the poly(imide-siloxane) composite films were studied.