Preparation and Properties of Poly(imide-siloxane) Composite Films with Al2O3 Particles
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Recent electronic devices such as smart applications and laptops are becoming smaller and lighter. To ensure proper the smaller device operation, the unwanted heat generated in the devices must be removed. Polyimides are widely used in optoelectronics, microelectronics and aerospace industries due to its excellent thermal stability, mechanical properties and low dielectric constant. In this work, Poly(imide-siloxane) copolymers (PIs) with different siloxane contents were synthesized and used as a matrix material of a PI/Al2O3 composite. The thermal conductivity, thermal stability, mechanical property, film flexibility and morphology of the PI/Al2O3 composite films were investigated for their application as a heat-dissipating material with different Al2O3 loadings.